Shenzhen HFC Co., Ltd. was established. R&D and production of EMI/EMC materials.
The branch office of sales was established in Japan. Conductive Gasket die- cut technology by automatic machine.
R&D and production of Absorber materials
The branch office of sales was established in USA and in HK. R&D and production TIM materials
SuZhou HFC-sub was established. HFC has established the first intelligent production line in China.
Chongqing HFC-sub was established.
6 laboratories were established including in MianYang, Zhongshan, Panyu etc. HFC has established the first automatic production line for I/O Gasket in China.
R&D and production of Ferrite sheet materials R&D and Production thermal pad of 6W/m.k
The branch office of sales was established in Taiwan. R&D and production Thermal Grease, Conductivity Thermal Pad, Non-silicon Thermal Pads
R&D and Production of Thermal Gel. 1~5W/m.k Non-silicon thermal gel be easy to peeling off.
R&D and production of 3W/m.k Phase-change material Thermal pad is used for Automotive industry.
1. High performance of thermal pad 10-20W/m.k.
2. Anti-RF thermal pad 1-3W/m.k
3. Soft Thermal pad of 7W/m.k
4. TIM of Low temperature metal materials
Surface anisotrope de controle thermique pour systeme 5G Won the Gold Award of the 46th Geneva International Invention Exhibition
America R&D 100 Honorary Unit.
Anisotropic Thermal Gap Filler (20~50W/m.k)
Vltra-thin Vapor Chamber
Copyright © Shenzhen HFC Co., Ltd. All Rights Reserved | Sitemap | Technical Support