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  • I/O EMI Gasket

I/O EMI Gasket

The I/O gasket is processed from conductive foam. I/O gaskets are designed for electromagnetic shielding at the input and output of various electronics. Conductive foam gaskets in different thickness, width or material can be specially designed and customized, then be punched into various shapes for different electronics.



• Good conductivity

• Good compressibility and resilience

• Good performance on EMI shield effectiveness

• RoHS compliant,halogen free

• Extensive working temperoture(-40**70°C)


PROPERTIES
ItemsParameterUnit
Surface Resistance0.05Q/inch2
Frequency Range(Test) (lOMHz-lGHz)>85dB
Resilience>80%
Vertical Resistance<0.05Q


All above data are copyrighted and elaborated by HFC.


COMPANY STRENGTH

Focus on innovative EMC and Thermal interface material R&D.

High capacity,short delivery cycles.

Product patent research and deveplopment results, adhere to innovation and make.

COMPANY STRENGTH
300

Production equipment and testing equipment to ensure high quality.

15000

Power prodcution and processing plant,specializing in customizing products.

Intimate after-sales team,respond quickly to each customers queston.

Tel

+86 755 2370 6023

Fax

+86 755 2730 6260

Add

Shenzhen, China 

 
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Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: avril@hfctech.com
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

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