Keywords: Thermal Interface Material, Absorbing Material, Shielding Material, Ferrite Sheet
Tags: EMI/EMC Shielding Material, RF Absorber Material, Thermal Gap Filler...
Home >> Products >> Thermal Interface Material >> Thermal Gap Filler
H100 Thermal Gap Filler

H100 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 1.0 W/m.k.

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H100 Thermal Gap Filler
H150 Thermal Gap Filler

H150 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 1.5 W/m.k.

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H150 Thermal Gap Filler
H200 Thermal Gap Filler

H200 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 2.0 W/m.k.

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H200 Thermal Gap Filler
H250 Thermal Gap Filler

H250 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 2.5 W/m.k.

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H250 Thermal Gap Filler
H300 Thermal Gap Filler

H300 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 3.0 W/m.k.

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H300 Thermal Gap Filler
H350 Thermal Gap Filler

H350 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 3.5 W/m.k.

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H350 Thermal Gap Filler
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Mobile Electronics Industry

3C is an abbreviation for three types of electronic products: computer, communication, and consumer electronics.

Netcom Industry

With the intelligent processing of electrical appliances and electronic products, many electronic devices need to be operated and controlled through the network.

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