H500 Thermal Gap Filler

Thermal gap filler has excellent flexibility insulation, compressibility and natural surface viscosity performances.it used to fill the gap and realize the heat transfer between the heating parts and cooling parts.It also has insulation and shock mitigation effects meanwhile, it can satisfy the design requirements for mini type and ultra-thin equipment with excellent manufacturability and practicability . with wide range of thickness ,it is widely used in electronic products.

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FEATURES

Soft,excellent compression performance

Low thermal resistance

Being recognized as UL94V0

Viscous surface

Being able to work under low pressure

Excellent insulation performance and thermal resistance

PRODUCT PARAMETERS

PROPERTIES
Items	Parameter	Unit	Test Method
Color	White	---	Visual
Thickness	0.5~3	mm	ASTM D 374
Hardness	25~55(±5)	Shore C	ASTM D 2240
Density	3.2±0.5	g/cc	ASTM D 792
Tensile strength	≥0.15	Mpa	ASTM D 412
Elongation	≥60	%	ASTM D 412
Compression Ratio	≥15（@50psi）	%	ASTM D 695
UL Certificaton	V-0	---	UL-94
Operating Temperature	-50~150	℃	IEC 60068-2-14
THERMAL CHARACTERISTIC
Thermal Conductivity	5.0±0.25	W/m · K	ASTM D 5470
Thermal Resistance	≤0.7（@20Psi/1mm）	℃in²/W	ASTM D 5470
ELECTRICAL PROPERTIES
Breakdown Voltage	≥7(@1mm)	KV/mm	ASTM D 149
Volume Resistivity	≥10¹⁰	Ω · cm	ASTM D 257
Dielectric Constant	≥5	@1MHz	ASTM D 150
Dielectric Loss	≤0.1	@1MHz	ASTM D 150