Thermal gap filler has excellent flexibility insulation, compressibility and natural surface viscosity performances.it used to fill the gap and realize the heat transfer between the heating parts and cooling parts.It also has insulation and shock mitigation effects meanwhile, it can satisfy the design requirements for mini type and ultra-thin equipment with excellent manufacturability and practicability with wide range of thickness ,it is widely used in electronic products.
Low thermal resistance
Being recognized as UL94V0
Viscous surface
Being able to work under low pressure
Excellent insulation performance and thermal resistance
PROPERTIES | |||
Items | Parameter | Unit | Test Method |
Color | Gray | --- | Visual |
Thickness | 0.5~3 | mm | ASTM D 374 |
Hardness | 35(±5) | Shore C | ASTM D 2240 |
Density | 3.25±0.5 | g/cc | ASTM D 792 |
Tensile strength | ≥0.1 | Mpa | ASTM D 412 |
Elongation | ≥45 | % | ASTM D 412 |
Compression Ratio | ≥15(@50psi) | % | ASTM D 695 |
Tear strength | ≥0.35 | N/mm | ASTM D 624 |
UL Certificaton | V-0 | --- | UL-94 |
Operating Temperature | -40~130 | ℃ | IEC 60068-2-14 |
THERMAL CHARACTERISTIC | |||
Thermal Conductivity | 8.0±0.25 | W/m · K | ASTM D 5470 |
Thermal Resistance | ≤0.3(@20Psi/1mm) | ℃in2/W | ASTM D 5470 |
ELECTRICAL PROPERTIES | |||
Breakdown Voltage | ≥3 | KV/mm | ASTM D 149 |
Volume Resistivity | ≥1010 | Ω · cm | ASTM D 257 |
Dielectric Constant | ≥5 | @1MHz | ASTM D 150 |
Dielectric Loss | ≤0.1 | @1MHz | ASTM D 150 |
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