Tags:
Home >> Products >> Thermal Interface Material >> Thermal Gel Series
  • Two Component Thermal Conductive Gel
  • Two Component Thermal Conductive Gel
  • Two Component Thermal Conductive Gel

Two Component Thermal Conductive Gel

 Two-component thermal conductive gel is a kind of heat conductive paste which can be cured at room temperature. After curing, it presents a flexible rubber elastomer. It is suitable for the electronic/electrical field with heat dissipation demand. It is especially suitable for the occasion where different components share a large gap of radiator. It can be dispensed automatically to realize automatic operation.


Replacing traditional assembled sheet with phase-change material

Dispensing can be done through various manual or automatic processes

It is soft, can eliminates assembly stress and damping

After curing, the required thickness can be maintained


  PROPERTIES


ItemsParameterUnitTest Method


HTG-100DHTG-150DHTG-200DHTG-300D


colorA componentgraygraywhitewhite-Visual


B componentblueyellowgraygray-Visual


After mixingGray whiteLight yellowGray whiteGray white-Visual


StateLow viscosity fluidHigh viscosity fluid--


Density1.6(±0.1)2.0(±0.2)≤2.51.6(±0.1)g/ccASTM D 792


Mixing ratio1:11:11:11:1-Mass ratio


Extrusion rate115(@0.4Mpa)16(@0.6Mpa)-95(@0.6Mpa)g/minGB/T 29755-2013


Curing conditionSurface curing0.5(@25℃)0.5(@25℃)1(@25℃)1(@25℃)H-


Complete curing24(@25℃)24(@25℃)24(@25℃)24(@25℃)H-


Accelerated curing1(@100℃)1(@100℃)15(@100℃)1(@100℃)min-


  THERMAL CHARACTERISTIC

  THERMAL CHARACTERISTIC
Thermal Conductivity1.0(±0.1)1.35(±0.1)≥2.03.0(±0.25)W/m · KASTM D 5470


Thermal Resistance≤1.5(@20Psi&1mm)≤1.5(@20Psi&1mm)≤1.0(@20Psi&1mm)≤1.0(@20Psi&1mm)℃in2/WASTM D 5470


Hardness45(±5)40(±5)35(±5)30(±5)Shore CASTM D 2240


Breakdown Voltage≥10≥10≥10≥10KV/mmASTM D 149


Volume Resistivity≥1010≥1010≥1012≥1012Ω · cmASTM D 257


Compression ratio≤20(@50Psi)≤25(@50Psi)≤20(@50Psi)≤20(@50Psi)@ASTM D 695


Tensile strength≥0.25≥0.35≥0.1≥0.2MpaASTM D 412


Elongation≥150≥200≥100≥200%ASTM D 412


Bonding strength--≥0.05≥0.05MpaASTM D 624


Spiral--≤1≤2.5%ASTM G 120


Tear Strength≥1.8≥2.5≥0.6≥1.2N/mmASTM D 624


Permittivity≥2≥2≥2≥2@1MHzASTM D 150


Dielectric loss≤0.1≤0.1≤0.1≤0.1@1MHzASTM D 150


UL CertificatonV-0V-0V-0V-0-UL-94


Operating Temperature-40~180-40~180-40~150-40~150IEC 60068-2-14




All above data are copyrighted and elaborated by HFC.

COMPANY STRENGTH

Focus on innovative EMC and Thermal interface material R&D.

High capacity,short delivery cycles.

Product patent research and deveplopment results, adhere to innovation and make.

COMPANY STRENGTH
300

Production equipment and testing equipment to ensure high quality.

15000

Power prodcution and processing plant,specializing in customizing products.

Intimate after-sales team,respond quickly to each customers queston.

Tel

+86 755 2370 6023

Fax

+86 755 2730 6260

Add

Shenzhen, China 

 
Tags:
Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: avril@hfctech.com
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

Copyright © Shenzhen HFC Co., Ltd. All Rights Reserved | Sitemap | Technical Support  

avril@hfctech.com