Two-component thermal conductive gel is a kind of heat conductive paste which can be cured at room temperature. After curing, it presents a flexible rubber elastomer. It is suitable for the electronic/electrical field with heat dissipation demand. It is especially suitable for the occasion where different components share a large gap of radiator. It can be dispensed automatically to realize automatic operation.
Replacing traditional assembled sheet with phase-change material
Dispensing can be done through various manual or automatic processes
It is soft, can eliminates assembly stress and damping
After curing, the required thickness can be maintained
PROPERTIES | ||||||||||
Items | Parameter | Unit | Test Method | |||||||
HTG-100D | HTG-150D | HTG-200D | HTG-300D | |||||||
color | A component | gray | gray | white | white | - | Visual | |||
B component | blue | yellow | gray | gray | - | Visual | ||||
After mixing | Gray white | Light yellow | Gray white | Gray white | - | Visual | ||||
State | Low viscosity fluid | High viscosity fluid | - | - | ||||||
Density | 1.6(±0.1) | 2.0(±0.2) | ≤2.5 | 1.6(±0.1) | g/cc | ASTM D 792 | ||||
Mixing ratio | 1:1 | 1:1 | 1:1 | 1:1 | - | Mass ratio | ||||
Extrusion rate | 115(@0.4Mpa) | 16(@0.6Mpa) | - | 95(@0.6Mpa) | g/min | GB/T 29755-2013 | ||||
Curing condition | Surface curing | 0.5(@25℃) | 0.5(@25℃) | 1(@25℃) | 1(@25℃) | H | - | |||
Complete curing | 24(@25℃) | 24(@25℃) | 24(@25℃) | 24(@25℃) | H | - | ||||
Accelerated curing | 1(@100℃) | 1(@100℃) | 15(@100℃) | 1(@100℃) | min | - | ||||
THERMAL CHARACTERISTIC | THERMAL CHARACTERISTIC | |||||||||
Thermal Conductivity | 1.0(±0.1) | 1.35(±0.1) | ≥2.0 | 3.0(±0.25) | W/m · K | ASTM D 5470 | ||||
Thermal Resistance | ≤1.5(@20Psi&1mm) | ≤1.5(@20Psi&1mm) | ≤1.0(@20Psi&1mm) | ≤1.0(@20Psi&1mm) | ℃in2/W | ASTM D 5470 | ||||
Hardness | 45(±5) | 40(±5) | 35(±5) | 30(±5) | Shore C | ASTM D 2240 | ||||
Breakdown Voltage | ≥10 | ≥10 | ≥10 | ≥10 | KV/mm | ASTM D 149 | ||||
Volume Resistivity | ≥1010 | ≥1010 | ≥1012 | ≥1012 | Ω · cm | ASTM D 257 | ||||
Compression ratio | ≤20(@50Psi) | ≤25(@50Psi) | ≤20(@50Psi) | ≤20(@50Psi) | @ | ASTM D 695 | ||||
Tensile strength | ≥0.25 | ≥0.35 | ≥0.1 | ≥0.2 | Mpa | ASTM D 412 | ||||
Elongation | ≥150 | ≥200 | ≥100 | ≥200 | % | ASTM D 412 | ||||
Bonding strength | - | - | ≥0.05 | ≥0.05 | Mpa | ASTM D 624 | ||||
Spiral | - | - | ≤1 | ≤2.5 | % | ASTM G 120 | ||||
Tear Strength | ≥1.8 | ≥2.5 | ≥0.6 | ≥1.2 | N/mm | ASTM D 624 | ||||
Permittivity | ≥2 | ≥2 | ≥2 | ≥2 | @1MHz | ASTM D 150 | ||||
Dielectric loss | ≤0.1 | ≤0.1 | ≤0.1 | ≤0.1 | @1MHz | ASTM D 150 | ||||
UL Certificaton | V-0 | V-0 | V-0 | V-0 | - | UL-94 | ||||
Operating Temperature | -40~180 | -40~180 | -40~150 | -40~150 | ℃ | IEC 60068-2-14 |
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