Keywords: Thermal Interface Material, Absorbing Material, Shielding Material, Ferrite Sheet
Tags: EMI/EMC Shielding Material, RF Absorber Material, Thermal Gap Filler...
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H1000 Thermal Gap Filler

H1000 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 10 W/m.k.

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H1000 Thermal Gap Filler
H800 Thermal Gap Filler

H800 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 8.0 W/m.k.

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H800 Thermal Gap Filler
H700 Thermal Gap Filler

H700 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 7.0 W/m.k.

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H700 Thermal Gap Filler
H600 Thermal Gap Filler

H600 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 6.0 W/m.k.

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H600 Thermal Gap Filler
H500 Thermal Gap Filler

H500 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 5.0 W/m.k.

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H500 Thermal Gap Filler
H400 Thermal Gap Filler

H400 series thermal gap filler is soft,it has low thermal resistance. Thermal conductivity is 4.0 W/m.k.

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H400 Thermal Gap Filler
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Mobile Electronics Industry

3C is an abbreviation for three types of electronic products: computer, communication, and consumer electronics.

Netcom Industry

With the intelligent processing of electrical appliances and electronic products, many electronic devices need to be operated and controlled through the network.

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